Fabrication of Poly(ethylene terephthalate) Fiber@Microporous Organic Polymer with Amino Groups@Cu Films for Flexible and Metal-Economical Electromagnetic Interference Shielding Materials

Seong In Park; Chang Wan Kang; Se Youn Cho; Sang Moon Lee; Hae Jin Kim; Yoon-Joo Ko; Jaewon Choi; Seung Uk Son

doi:10.1021/acs.langmuir.0c00962

Fabrication of Poly(ethylene terephthalate) Fiber@Microporous Organic Polymer with Amino Groups@Cu Films for Flexible and Metal-Economical Electromagnetic Interference Shielding Materials

Langmuir. 2020 Aug 4;36(30):8745-8752. doi: 10.1021/acs.langmuir.0c00962. Epub 2020 Jul 21.

Authors

Seong In Park¹, Chang Wan Kang¹, Se Youn Cho², Sang Moon Lee³, Hae Jin Kim³, Yoon-Joo Ko⁴, Jaewon Choi⁵, Seung Uk Son¹

Affiliations

¹ Department of Chemistry, Sungkyunkwan University, Suwon 16419, Korea.
² Carbon Composite Materials Research Center, Korea Institute of Science and Technology (KIST), Wanju 55324, Korea.
³ Korea Basic Science Institute, Daejeon 34133, Korea.
⁴ Laboratory of Nuclear Magnetic Resonance, National Center for Inter-University Research Facilities (NCIRF), Seoul National University, Seoul 08826, Korea.
⁵ Department of Chemistry, Gyeongsang National University, Jinju 52828, Korea.

PMID: 32633126
DOI: 10.1021/acs.langmuir.0c00962

Abstract

Flexible and metal-economical electromagnetic interference (EMI) shielding films were fabricated based on microporous organic polymer (MOP) chemistry. MOP with amino groups (MOP-A) could be introduced to the surface of poly(ethylene terephthalate) (PET) fibers. Due to the microporosity and amino groups of MOP-A, Ag⁺ could be easily incorporated into PET@MOP-A. Through Ag-catalyzed electroless Cu deposition, PET@MOP-A@Cu films were fabricated. The morphological and chemical structures of the PET@MOP-A@Cu were characterized by scanning electron microscopy, X-ray diffraction studies, and X-ray photoelectron spectroscopy. Among the films, the PET@MOP-A@Cu-40 with 41 wt % Cu (a thickness of 0.64 μm) showed excellent EMI shielding performance with 64.3-73.8 dB against an EM of 8-12 GHz. Moreover, it showed retention of the original EMI shielding performance against 1000 bending (R = 5 mm) tests.