Microstructure Evolution and Mechanical Stability of Supersaturated Solid Solution Co-Rich Nanocrystalline Co-Cu Produced by Pulsed Electrodeposition

Killang Pratama; Jenifer Barrirero; Frank Mücklich; Christian Motz

doi:10.3390/ma13112616

Microstructure Evolution and Mechanical Stability of Supersaturated Solid Solution Co-Rich Nanocrystalline Co-Cu Produced by Pulsed Electrodeposition

Materials (Basel). 2020 Jun 8;13(11):2616. doi: 10.3390/ma13112616.

Authors

Killang Pratama^{1

2}, Jenifer Barrirero³, Frank Mücklich³, Christian Motz¹

Affiliations

¹ Chair of Materials Science and Methods, Saarland University, 66123 Saarbrücken, Germany.
² Department of Metallurgical Engineering, Institute Technology of Bandung, Bandung 40132, Indonesia.
³ Chair of Functional Materials, Saarland University, 66123 Saarbrücken, Germany.

Abstract

Thick films of supersaturated solid solution nanocrystalline Co-Cu (28 at.% Cu) were synthesized through the pulsed electrodeposition technique. Microstructural changes of nanocrystalline Co-Cu were intensively studied at various annealing temperatures. Annealing at 300 °C results in a spinodal decomposition within the individual grains, with no grain coarsening. On the other hand, distinct phase separation of Co-Cu is detected at annealing temperatures beyond 400 °C. Static micro-bending tests show that the nanocrystalline Co-Cu alloy exhibits a very high yield strength and ductile behavior, with no crack formation. Static micro-bending tests also reported that a large plastic deformation is observed, but no microstructure change is detected. On the other hand, observation on the fatigue resistance of nanocrystalline Co-Cu shows that grain coarsening is observed after conducting the cyclic micro-bending test.

Keywords: mechanical stability; micro mechanics; nanocrystalline Co-Cu; spinodal decomposition.

Abstract

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