Directional couplers are extensively used in photonic integrated circuits as basic components for efficient on-chip photonic signal routing. Conventionally, directional couplers are fully encapsulated in the technology's waveguide cladding material. In this Letter, we demonstrate a compact broadband directional coupler, fully suspended in air and exhibiting efficient power coupling in the cross state. The coupler is designed and built based on IMEC's iSiPP50G standard platform, and hydrofluoric (HF) vapor-etching-based post-processing allows to release the freestanding component. A low insertion loss of 0.5 dB at λ=1560nm and a 1 dB bandwidth of 35 nm at λ=1550nm have been confirmed experimentally. With a small footprint of 20µm×30µm and high mechanical stability, this directional coupler can serve as a basic building block for large-scale silicon photonic microelectromechanical systems (MEMS) circuits.