Atomistic Positioning of Defects in Helium Ion Treated Single-Layer MoS2

Nano Lett. 2020 Jun 10;20(6):4437-4444. doi: 10.1021/acs.nanolett.0c01222. Epub 2020 May 12.

Abstract

Structuring materials with atomic precision is the ultimate goal of nanotechnology and is becoming increasingly relevant as an enabling technology for quantum electronics/spintronics and quantum photonics. Here, we create atomic defects in monolayer MoS2 by helium ion (He-ion) beam lithography with a spatial fidelity approaching the single-atom limit in all three dimensions. Using low-temperature scanning tunneling microscopy (STM), we confirm the formation of individual point defects in MoS2 upon He-ion bombardment and show that defects are generated within 9 nm of the incident helium ions. Atom-specific sputtering yields are determined by analyzing the type and occurrence of defects observed in high-resolution STM images and compared with Monte Carlo simulations. Both theory and experiment indicate that the He-ion bombardment predominantly generates sulfur vacancies.

Keywords: Two-dimensional materials; defect engineering; helium ion microscopy; scanning tunneling microscopy.