Rheological and Electrical Study of a Composite Material Based on an Epoxy Polymer Containing Cyclotriphosphazene

O Dagdag; M El Gouri; A El Mansouri; A Outzourhit; A El Harfi; O Cherkaoui; A El Bachiri; O Hamed; S Jodeh; G Hanbali; B Khalaf

doi:10.3390/polym12040921

Rheological and Electrical Study of a Composite Material Based on an Epoxy Polymer Containing Cyclotriphosphazene

Polymers (Basel). 2020 Apr 16;12(4):921. doi: 10.3390/polym12040921.

Authors

O Dagdag¹, M El Gouri¹, A El Mansouri², A Outzourhit³, A El Harfi⁴, O Cherkaoui⁵, A El Bachiri⁶, O Hamed⁷, S Jodeh⁷, G Hanbali⁷, B Khalaf⁷

Affiliations

¹ Laboratory of Industrial Technologies and Services (LITS), Department of Process Engineering, Height School of Technology, Sidi Mohammed Ben Abdallah University, P.O. Box 2427, Fez 30000, Morocco.
² LPSCM, Department of physics, Faculty of Sciences Semlalia, Cadi Ayyad University, Marrakech PB 2390, Morocco.
³ Nanomaterials for Energy and Environment Laboratory, Cadi Ayyad University, Marrakech PB 2390, Morocco.
⁴ Laboratory of Advanced Materials and Process Engineering, Department of Chemistry, Faculty of Science, Ibn Tofail University, BP 133, Kenitra 14000, Morocco.
⁵ Higher School of Textile and Clothing Industries, Laboratory REMTEX, Oulfa BP 7731, Casablanca, Morocco.
⁶ University Department, Royal Naval School, Sour Jdid Boulevard, Casablanca B.P 16303, Morocco.
⁷ Department of Chemistry, An-Najah National University, Nablus P. O. Box 7, Palestine.

Abstract

In this work, we have studied, formulated, prepared, and characterized the rheological and electrical behavior of a composite material based on an epoxy resin Diglycidyl Ether of Bisphenol A (DGEBA) reinforced with hexaglycidyl cyclotriphosphazene (HGCP). The epoxy system was cured with 4,4'-methylene dianiline (MDA). DGEBA-HGCP-MDA epoxy composite materials with reinforced HGCP which varied from 5% to 10% by weight were prepared by mixing in the molten state. The morphology was evaluated by SEM. The rheological behavior was studied using small deformation rheology. The electrical characterization was carried out with a frequency variation range from 1 Hz to 100 KHz at room temperature. These measurements revealed that the rheological and electrical behaviors strongly depend on the quantity of HGCP in the DGEBA matrix. The linear viscoelastic properties study reveals that the modulus of elasticity G' is dependent on the amount of HGCP present in the epoxy resin DGEBA. The capacitance-frequency measurements suggest a distribution of localized states in the band gap of the blends.

Keywords: HGCP; composite; epoxy resin; rheological and electrical behavior.