Micro/nanostructures with high aspect ratios in silicon wafers obtained by plasma etching are of great significance in device fabrication. In most cases, the scallop nanostructure in deep silicon etching should be suppressed. However, the scallop nanostructure could be applied in electronic device fabrication as characteristic information, which indicates the balance between deposition and etching. In this work, the applications of scallop nanostructures in etching process optimization and environmental protection are demonstrated. In addition, the minimum effect of the cycle time on the scallop size is reported for the first time. These results could bring new thoughts to the electronic devices related fields, such as micro-electro-mechanical systems (MEMS), silicon capacitors and advanced packaging.