The recent technology of transfer printing using various membrane-type flexible/stretchable electronic devices can provide electronic functions to desirable objects where direct device fabrication is difficult. However, if the target surfaces are rough and complex, the capability of accommodating surface mismatches for reliable interfacial adhesion remains a challenge. Here, we demonstrate that newly designed nanotubular cilia (NTCs), vertically aligned underneath a polyimide substrate, significantly enhance interfacial adhesion. The tubular structure easily undergoes flattening and wrapping motions to provide a large conformal contact area, and the synergetic effect of the assembled cilia strengthens the overall adhesion. Furthermore, the hierarchical structure consisting of radially spread film-type cilia combined with vertically aligned NTCs in specific regions enables successful transfer printing onto very challenging surfaces such as stone, bark, and textiles. Finally, we successfully transferred a temperature sensor onto an eggshell and indium gallium zinc oxide-based transistors onto a stone with no electrical failure.
Keywords: flexible electronics; hierarchical structure; interfacial adhesion; multiscale roughness; nanotubular cilia; transfer printing.