As the technology of flexible electronics has remarkably advanced, the long-term reliability of flexible devices has attracted much attention, as it is an important factor for such devices in reaching real commercial viability. To guarantee the bending fatigue lifetime, the exact evaluation of bending strain and the change in electrical resistance is required. In this study, we investigated the bending strains of Cu thin films on flexible polyimide substrates with different thicknesses using monolayer and bilayer bending models and monitored the electrical resistance of the metal electrode during a bending fatigue test. For a thin metal electrode, the bending strain and fatigue lifetime were similar regardless of substrate thickness, but for a thick metal film, the fatigue lifetime was changed by different bending strains in the metal electrode according to substrate thickness. To obtain the exact bending strain distribution, we conducted a finite-element simulation and compared the bending strains of thin and thick metal structures. For thick metal electrodes, the real bending strain obtained from a bilayer model or simulation showed values much different from those from a simple monolayer model. This study can provide useful guidelines for developing highly reliable flexible electronics.
Keywords: bending strain; flexible; metal electrode; reliability.