The fabrication and characterization protocol for a metasurface beam splitter, enabling equal-intensity beam generation, is demonstrated. Hydrogenated amorphous silicon (a-Si:H) is deposited on the fused silica substrate, using plasma-enhanced chemical vapor deposition (PECVD). Typical amorphous silicon deposited by evaporation causes severe optical loss, impinging the operation at visible frequencies. Hydrogen atoms inside the amorphous silicon thin film can reduce the structural defects, improving optical loss. Nanostructures of a few hundreds of nanometers are required for the operation of metasurfaces in the visible frequencies. Conventional photolithography or direct laser writing is not feasible when fabricating such small structures, due to the diffraction limit. Hence, electron beam lithography (EBL) is utilized to define a chromium (Cr) mask on the thin film. During this process, the exposed resist is developed at a cold temperature to slow down the chemical reaction and make the pattern edges sharper. Finally, a-Si:H is etched along the mask, using inductively coupled plasma-reactive ion etching (ICP-RIE). The demonstrated method is not feasible for large-scale fabrication due to the low throughput of EBL, but it can be improved upon by combining it with nanoimprint lithography. The fabricated device is characterized by a customized optical setup consisting of a laser, polarizer, lens, power meter, and charge-coupled device (CCD). By changing the laser wavelength and polarization, the diffraction properties are measured. The measured diffracted beam powers are always equal, regardless of the incident polarization, as well as wavelength.