Intense interest has been given to the fabrication of micro-through-holes with smaller tapering and higher aspect ratios in engineering ceramics due to their wide range of applications in MEMS and aerospace. A semi-water-immersed laser micro-trepanning (SWILT) scheme is proposed and investigated in this paper with alumina ceramics as the target material, and its performance is assessed and compared with the direct laser trepanning method. Relevant processing parameters influencing the trepanning process are explored through an orthogonally designed experiment, and their effects on hole profiles are adequately discussed to yield optimized parameters. It is revealed that SWILT is capable of producing micro-through-holes with minimized hole tapering and much straighter sidewalls compared with the direct trepanning results, whereas the ablated surface quality is relatively rougher. The micro-through-hole formation mechanisms are also amply analyzed, where the transition hole development may be purely attributed to the laser-material interaction in the direct laser trepanning condition, while the SWILT case features an enhanced material-removal rate, especially at the lower part of the through-hole. The latter is due to the strengthened mechanical effects coming from the water-confined plasma zone and the following cavitation bubble collapse, which may efficiently expel the molten material from sidewalls and result in significantly reduced hole tapering.
Keywords: Picosecond laser; alumina ceramics; micro-trepanning; semi-water-immersed; through hole formation mechanism.