A high-temperature sensor based on a metamaterial unit cell is proposed in this paper. The wireless passive temperature sensing method is based on the electromagnetic backscatter principle, and thus has the advantages of higher quality, lower environmental interference, and anti-low frequency interference. We developed a finite-element method-based model for the sensor via high-frequency simulation software (HFSS). A double split-ring resonator (SRR) with an outer ring length of 13 mm was designed on alumina ceramic substrate. The sensor was fabricated at 2.42 GHz using micromechanical technology and screen printing technology. When the temperature increased from 28 to 1100 °C, the resonant frequency decreased from 2.417 to 2.320 GHz with an average sensitivity of 95.63 kHz/°C. As the sensor is easily designed and fabricated, it can be used for chipless radio frequency identification (RFID) tags by simply changing the size of rings. Furthermore, emerging 3D printing technology and commercial desktop inkjet printers will be used to realize the rapid low-cost preparation of the sensor, enabling its wide range of applications in aerospace, military, manufacturing, transportation, and other fields.
Keywords: SRR-based sensor; chipless radio frequency identification; electromagnetic backscatter principle; high-temperature sensor.