Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer

Yong Xiao; Qiwei Wang; Ling Wang; Xian Zeng; Mingyu Li; Ziqi Wang; Xingyi Zhang; Xiaomeng Zhu

doi:10.1016/j.ultsonch.2018.03.005

Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer

Ultrason Sonochem. 2018 Jul:45:223-230. doi: 10.1016/j.ultsonch.2018.03.005. Epub 2018 Mar 16.

Authors

Yong Xiao¹, Qiwei Wang¹, Ling Wang², Xian Zeng³, Mingyu Li⁴, Ziqi Wang⁴, Xingyi Zhang¹, Xiaomeng Zhu¹

Affiliations

¹ School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China.
² China National Electric Apparatus Research Institute Co, Ltd, Guangzhou 510300, China.
³ School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China. Electronic address: zengxian9925@163.com.
⁴ State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Shenzhen 518055, China.

PMID: 29705316
DOI: 10.1016/j.ultsonch.2018.03.005

Abstract

In this study, Cu alloy joints were fabricated with a Ni-foam reinforced Sn-based composite solder with the assistance of ultrasonic vibration. Effects of ultrasonic soldering time on the microstructure and mechanical properties of Cu/Ni-Sn/Cu joints were investigated. Results showed that exceptional metallurgic bonding could be acquired with the assistance of ultrasonic vibration using a self-developed Ni-foam/Sn composite solder. For joint soldered for 5 s, a (Cu,Ni)₆Sn₅ intermetallic compound (IMC) layer was formed on the Cu substrate surface, Ni skeletons distributed randomly in the soldering seam and a serrated (Ni,Cu)₃Sn₄ IMC layer was formed on the Ni skeleton surface. Increasing the soldering time to 20 s, the (Ni,Cu)₃Sn₄ IMC layer grew significantly and exhibited a loose porous structure on the Ni skeleton surface. Further increase the soldering time to 30 s, Ni skeletons were largely dissolved in the Sn base solder, and micro-sized (Ni,Cu)₃Sn₄ particles were formed and dispersed homogeneously in the soldering seam. The formation of (Ni,Cu)₃Sn₄ particles was mainly ascribed to acoustic cavitations induced erosion and grain refining effects. The joint soldered for 30 s exhibited the highest shear strength of 64.9 ± 3.3 MPa, and the shearing failure mainly occurred at the soldering seam/Cu substrate interface.

Keywords: Acoustic cavitations; Cu alloy joint; Interfacial reaction; Ni-foam; Sn solder; Ultrasonic soldering.