High integration of electronic chip not only improved the electronic device’s efficiency, but also left the need to stop emitting heat. Thermal interface material (TIM) has been proposed to solve this problem. Traditionally, a large amount of high thermal conductive materials (such as Cu, Al or AlN) was added for better thermal conductivity, which caused undesirable weight-increasing and property-sacrificing. Graphene has great thermal conductivity and mechanical properties. Furthermore, owing to its low density, it is possible to make a lot of TIM even with a small amount. Being composited with PU, it can be an enhanced thermal conductive adhesive. Otherwise, amine compound is considered to be applicable as both a chain extender of PU and a reducing agent of Graphene oxide (GO). In this work, we synthesized PU-GO composite by chemical reaction of NCO and GO. We examined the effects of various amine compounds on chemical and physical properties of GO and PU-GO composite. Adhesion and thermal properties were also studied.
Keywords: PU-GO Composite; Thermal Conductive Adhesive; Graphene Oxide (GO) Reaction.