Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Z L Li; H J Dong; X G Song; H Y Zhao; J C Feng; J H Liu; H Tian; S J Wang

doi:10.1016/j.ultsonch.2016.12.026

Rapid formation of Ni₃Sn₄ joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Ultrason Sonochem. 2017 May:36:420-426. doi: 10.1016/j.ultsonch.2016.12.026. Epub 2016 Dec 20.

Authors

Z L Li¹, H J Dong¹, X G Song², H Y Zhao³, J C Feng³, J H Liu¹, H Tian¹, S J Wang¹

Affiliations

¹ Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China.
² Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China. Electronic address: xgsong@hitwh.edu.cn.
³ Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.

PMID: 28069229
DOI: 10.1016/j.ultsonch.2016.12.026

Abstract

High melting point Ni₃Sn₄ joints for the die attachment of SiC-based high temperature power devices was successfully achieved using an ultrasound-induced transient liquid phase (TLP) bonding process within a remarkably short bonding time of 8s. The formed intermetallic joints, which are completely composed of the refined equiaxial Ni₃Sn₄ grains with the average diameter of 2μm, perform the average shear strength of 26.7MPa. The sonochemical effects of ultrasonic waves dominate the mechanism and kinetics of the rapid formation of Ni₃Sn₄ joints.

Keywords: EBSD; Grain morphology; Ni(3)Sn(4) joints; Orientation relationship; TLP bonding; Ultrasonic soldering.