Mechanically Reinforced Skin-Electronics with Networked Nanocomposite Elastomer

Seungyong Han; Min Ku Kim; Bo Wang; Dae Seung Wie; Shuodao Wang; Chi Hwan Lee

doi:10.1002/adma.201603878

Mechanically Reinforced Skin-Electronics with Networked Nanocomposite Elastomer

Adv Mater. 2016 Dec;28(46):10257-10265. doi: 10.1002/adma.201603878. Epub 2016 Oct 7.

Authors

Seungyong Han¹, Min Ku Kim², Bo Wang³, Dae Seung Wie², Shuodao Wang³, Chi Hwan Lee⁴

Affiliations

¹ Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.
² School of Mechanical Engineering, Purdue University, West Lafayette, IN, 47907, USA.
³ School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater, OK, 74078, USA.
⁴ Weldon School of Biomedical Engineering, School of Mechanical Engineering, Center for Implantable Devices, Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA.

PMID: 27714861
DOI: 10.1002/adma.201603878

Abstract

Mechanically reinforced skin-electronics are presented by exploiting networked nanocomposite elastomers where high quality metal nanowires serve as conducting paths. Theoretical and experimental studies show that the established skin-electronics exhibit superior mechanical enhancements against crack and delamination phenomena. Device applications include a class of biomedical devices that offers the ability of thermotherapeutic stimulation and electrophysiological monitoring, all via the skin.

Keywords: biomedical sensors; mechanical enhancement; networked nanowires; skin-electronics.