Note: A component-level frequency tunable isolator for vibration-sensitive chips using SMA beams

Xiaoyong Zhang; Xin Ding; Di Wu; Junlei Qi; Ruixin Wang; Siwei Lu; Xiaojun Yan

doi:10.1063/1.4953922

Note: A component-level frequency tunable isolator for vibration-sensitive chips using SMA beams

Rev Sci Instrum. 2016 Jun;87(6):066106. doi: 10.1063/1.4953922.

Authors

Xiaoyong Zhang¹, Xin Ding¹, Di Wu¹, Junlei Qi¹, Ruixin Wang¹, Siwei Lu¹, Xiaojun Yan¹

Affiliation

¹ School of Energy and Power Engineering, Beihang University, Beijing 100191, China.

PMID: 27370507
DOI: 10.1063/1.4953922

Abstract

This note presents a component-level frequency tunable isolator for vibration-sensitive chips. The isolator employed 8 U-shaped shape memory alloy (SMA) beams to support an isolation island (used for mounting chips). Due to the temperature-induced Young's modulus variation of SMA, the system stiffness of the isolator can be controlled through heating the SMA beams. In such a way, the natural frequency of the isolator can be tuned. A prototype was fabricated to evaluate the concept. The test results show that the natural frequency of the isolator can be tuned in the range of 64 Hz-97 Hz by applying different heating strategies. Moreover, resonant vibration can be suppressed significantly (the transmissibility decreases about 65% near the resonant frequency) using a real-time tuning method.