Brittle intermetallics such as Cu6 Sn5 can be transformed into low cost, nonbrittle, superplastic and high temperature-resistant interconnection materials by sintering at temperatures more than 200 °C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore-free with nanograins, and the interface is super-uniform.
Keywords: TEM; high temperature interconnection; intermetallics; nanoparticles; sintering.
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