Facile preparation of high-performance elastically stretchable interconnects

Andreas Polywka; Timo Jakob; Luca Stegers; Thomas Riedl; Patrick Görrn

doi:10.1002/adma.201501461

Facile preparation of high-performance elastically stretchable interconnects

Adv Mater. 2015 Jul 1;27(25):3755-9. doi: 10.1002/adma.201501461. Epub 2015 May 20.

Authors

Andreas Polywka¹, Timo Jakob¹, Luca Stegers¹, Thomas Riedl², Patrick Görrn¹

Affiliations

¹ Chair of Large Area Optoelectronics, University of Wuppertal, Rainer-Gruenter-Str. 21, 42119, Wuppertal, Germany.
² Institute of Electronic Devices, University of Wuppertal, Rainer-Gruenter-Str. 21, 42119, Wuppertal, Germany.

PMID: 25995085
DOI: 10.1002/adma.201501461

Abstract

Sites on poly(dimethylsiloxane) are selected by ultraviolet exposure. In a subsequent electroless deposition, solid silver films are created on the selected sites only. In this way, facile vacuum-free deposition of electrodes from the liquid phase and their photoresist- and solvent-free patterning are realized. The technique enables reliable rigid-to-soft interconnects that are reversibly stretchable under arbitrary and changing stretching directions.

Keywords: electroless deposition; lithography; poly(dimethylsiloxane) (PDMS); silver; stretchable.