Ge/Si heterojunction photodiodes fabricated by low temperature wafer bonding

Opt Express. 2013 Jul 15;21(14):17309-14. doi: 10.1364/OE.21.017309.

Abstract

We report on the photoresponse of an asymmetrically doped p(-)-Ge/n(+)-Si heterojunction photodiode fabricated by wafer bonding. Responsivities in excess of 1 A/W at 1.55 μm are measured with a 5.4 μm thick Ge layer under surface-normal illumination. Capacitance-voltage measurements show that the interfacial band structure is dependent on both temperature and light level, moving from depletion of holes at -50 °C to accumulation at 20 °C. Interface traps filled by photo-generated and thermally-generated carriers are shown to play a crucial role. Their filling alters the potential barrier height at the interface leading to increased flow of dark current and the above unity responsivity.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Crystallization / methods*
  • Equipment Design
  • Equipment Failure Analysis
  • Germanium / chemistry*
  • Germanium / radiation effects
  • Materials Testing
  • Photometry / instrumentation*
  • Semiconductors*
  • Silicon / chemistry*
  • Silicon / radiation effects
  • Temperature

Substances

  • Germanium
  • Silicon