THz quantum cascade lasers with wafer bonded active regions

Opt Express. 2012 Oct 8;20(21):23832-7. doi: 10.1364/OE.20.023832.

Abstract

We demonstrate terahertz quantum-cascade lasers with a 30 μm thick double-metal waveguide, which are fabricated by stacking two 15 μm thick active regions using a wafer bonding process. By increasing the active region thickness more optical power is generated inside the cavity, the waveguide losses are decreased and the far-field is improved due to a larger facet aperture. In this way the output power is increased by significantly more than a factor of 2 without reducing the maximum operating temperature and without increasing the threshold current.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Equipment Design
  • Equipment Failure Analysis
  • Lasers*
  • Quantum Theory*
  • Refractometry / instrumentation*
  • Terahertz Radiation*