Ripple formation on silicon by medium energy ion bombardment

J Phys Condens Matter. 2009 Jun 3;21(22):224004. doi: 10.1088/0953-8984/21/22/224004. Epub 2009 May 12.

Abstract

The formation of a self-organized nanoscale ripple pattern after off-normally incident ion bombardment on the surface of amorphous materials, or on semiconductors like silicon that are easily amorphized by ion bombardment, has attracted much attention in recent years from the point of view of both theory and applications. As the energy of the impinging ions increases from low to medium, i.e. several hundred eV to a few tens of keV, the ratio of amplitude to wavelength of the generated ripple pattern becomes so large that inter-peak shadowing of the incident ion flux takes place. Morphologically, the sinusoidal surface profile starts to become distorted after prolonged ion bombardment under such conditions. Structural and compositional modifications of the ripple morphology generated under shadowing conditions include the formation of a thicker amorphous layer with high incorporation of argon atoms in the form of nanometer sized bubbles around the middle part of the front slope of the ripple facing the ion beam, as compared to the rear slope. The present paper reviews recent developments in the experimental study of morphological, structural and compositional aspects of ripple patterns generated on a silicon surface after medium keV (30-120 keV) argon bombardment mainly at an angle of ion incidence of 60°.