Thermoplastics such as cyclic olefin copolymer (COC) and polymethylmethacrylate (PMMA) have been increasingly used in fabricating microfluidic devices. However, the state-of-the-art microvalve technology is a polydimethylsiloxane (PDMS)-based three-layer structure. In order to integrate such a valve with a thermoplastics-based microfluidic device, a bonding method for thermoplastics/PDMS must be developed. We report here a method to bond COC with PDMS through surface activation by corona discharge, surface modification using 3-(trimethoxysilyl)propyl methacrylate (TMSPMA), and thermal annealing. The method is also applicable to PMMA. The bonding strength between thermoplastics and PDMS was represented by the peeling force, which was measured using a method established by the International Organization for Standardization (ISO). The bonding strength measurement offered an objective and quantitative indicator for protocol optimization, as well as comparison with other PDMS-associated bonding methods. Using optimized bonding conditions, two valve arrays were fabricated in a COC/PDMS/COC device and cyclic operations of valve closing/opening were successfully demonstrated. The valve-containing devices withstood 100 psi (∼689 KPa) without delamination. Further, we integrated such valve arrays in a device for protein separation and demonstrated isoelectric focusing in the presence of valves.