An effective lift-off method for patterning high-density gold interconnects on an elastomeric substrate

Small. 2010 Dec 20;6(24):2847-52. doi: 10.1002/smll.201001456.

Abstract

High-resolution, high-density gold interconnects are effectively patterned on an elastomeric substrate. A 3cm cable of ten gold wires with 10μm width and 20μm pitch is achieved, successfully demonstrating density increases of more than one order of magnitude from previously established work. Many applications in the fields of stretchable electronics and conformable neural interfaces will benefit from these fabrication developments.

Publication types

  • Research Support, N.I.H., Extramural

MeSH terms

  • Dimethylpolysiloxanes / chemistry
  • Electronics / methods*
  • Gold / chemistry*

Substances

  • Dimethylpolysiloxanes
  • Gold