A simple procedure to elaborate robust ultraflat gold surface without clean room facilities is presented. Self-assembled 3-mercaptopropytriethoxysilane (MPTMS) on silicon was used as a buffer layer on which gold was sputtered using a common sputter-coating apparatus. The optimization of the sample position into the chamber of the sputtering machine yielded the formation of a thin (approximately 8 nm) gold layer. The characterization of the resulting gold surface (i.e., AFM, X-ray reflectivity, and diffraction) has demonstrated its high smoothness (<0.7 nm) over a large scale with a preferred (111) orientation. The robustness of the substrate toward organic solvents and thermal treatment was also tested. The ability of these surfaces to be used as substrates for high-resolution surface modification was confirmed by functionalizing the gold surface using the dip pen nanolithography process.