The advanced mechanical testing of microelectromechanical systems (MEMS) is necessary to provide feedback of measurements that can help the designer optimize MEMS structures and improve the reliability and stability of MEMS. We describe a digital image correlation (DIC) method for dynamic characterization of MEMS using an optical microscope with a high-speed complementary metaloxide semiconductor-based camera. The mechanical performance of a series of microgyroscopes is tested. The DIC method is employed to measure the microgyroscope in-plane displacement with subpixel accuracy. Use of the DIC method is less restrictive on the surface quality of the specimen and simplifies the measurement system. On the basis of a series of temporal digital images grabbed by a high-speed camera, the stability characteristic of the microgyroscopes is analyzed. In addition, the quality factors of the microgyroscopes are determined and agree well with other experimental methods.